Tag Archives: 2017

PackPlus Creates New Landmarks, Yet Again!

The Indian packaging, processing and supply chain industries had a very positive beginning of August this year. PackPlus 2017, which happened from 3rd to 6th of the month, provided a global business and networking platform to the 350+ participating companies and hosted 80+ product launches, 200+ running machines and several other attractions. The show was read more »

PackPlus South’17 accomplishes a yet another successful expedition at Bengaluru!!

With a footfall of 7523 unique visitors, South India’s largest packaging Show, PackPlus South’17 has been highly effective in catering solutions to various packaging, printing and supply chain segments. PackPlus South concluded successfully along with PrintFair and SupplyPlus South 2017 on 10th April at BIEC, Bengaluru. The four day show featured 200+ exhibitors, 100+ live read more »

2608 Unique Visitors Mark Their Presence @ PackPlus South – Day 3!!

PackPlus South along with PrintFair and SupplyPlus South 2017 gathered a footfall of 2608 visitors on third day. Leading industry players and important decision makers marked their presence. The show features 200+ Exhibitors, 50+ Product Launches, 100+ Live Demos and several other attractions. Last day today. Do not miss the opportunity to meet leading players read more »

PackPlus South 2017 Begins Today @ Bengaluru – 1547 Visitors Mark Their Presence

PackPlus South along with PrintFair and SupplyPlus South 2017 gathered a footfall of 1547 visitors on first day and expecting many more in coming days. The show features 200+ Exhibitors, 50+ Product Launches, 100+ Live Demos and several other attractions. Three more day to go. Do not miss the opportunity to meet leading players from read more »

Inkjet Solutions introduces Thermal Transfer Overpinting and Large Character DOD Printers

Inkjet Solutions introduces Thermal Transfer Overpinting and Large Character DOD Printers. It also provides services and maintenance solutions in addition to supply of consumables /spares for all equipments. Thermal Transfer Overprinting (TTO) High quality print— robust and durable Thermal Transfer Overprinting (TTO) is another high resolution technology printing and coding solution used for marking flexible read more »

PackPlus South’17 Goes Extra Mile to Make South India’s Largest Extravagant

Weeks ahead of the Show, PackPlus South 2017 and Print Fair 2017, the promotions have begun. A hundred thousand personal invitations have been sent out and now, the organizers are going an extra mile to make the South India’s Largest Show more distinctive. The hoardings are being placed at strategic locations across the city and read more »

Cosmo Films to Offer Ultra High Barrier Films

Cosmo Films, a leading manufacturer of specialty BOPP films, has introduced several additions to its range of barrier films and now has a significant portfolio of transparent as well as metallised varieties. These solvent-free coated films, used for a wide range of FMCG packaging applications not only help extend the shelf life of the contents read more »

Uflex unveils Asepto, Aseptic Liquid Packaging Brand

Uflex, Flexible Packaging and Solution Company has recently unveiled ‘ASEPTOTM’ its Aseptic Liquid Packaging Brand. Uflex’s Aseptic Liquid Packaging manufacturing plant that will be commercially operational by April 2017 perfectly echoes Government of India’s Make In India ethos. According to Ashwani Sharma, President and CEO, new business initiatives, Uflex, Aseptic packaging market in India is read more »

PrintFair Gears Up for its 2017 Edition

PrintFair is all geared up for its succeeding edition happening along with PackPlus South and SupplyPlus South from 7 to 10 April, 2017 at BIEC, Bengaluru. PrintFair’s earlier edition that happened at HITEX, Hyderabad was a great triumph. It was visited by numerous industry veterans and closed some remarkable deals and also generated a lot read more »

Uflex transforms tortilla chips’ packaging for Whole Foods

India’s flexible packaging firm Uflex has developed a new pouch for Whole Foods Market’s tortilla chips. The pouch has three layers – 12.5 micron coated polyester, 18 micron BOPP treated on both sides and 35 micron polyethylene. The packaging structure is that of a 3D flat bottom pouch. The pouch is reverse printed and the read more »