The high profile networking & knowledge event will be held on 5 October at Jaypee Green Golf Spa and Resort, Greater Noida, New Delhi (NCR).
The International Packaging Conclave is conceived as a smart networking and knowledge sharing event that looks at one big idea or trend in an interactive afternoon every edition. The event brings together International thought leaders and the Indian Industry stakeholders focusing on a collaborative theme.
The theme of Integration and collaboration across the entire packaging value chain in the previous year leads us to look at the Package design and the need to maintain its integrity through conceptualisation, conversion & filling and closing of the pack in the International Packaging Conclave 2013.
“One of the main issues with the Indian packaging and FMCG industries is compartmentalized thinking. They often end up optimizing their functional area but pushing the entire system to sub optimal levels. The new format Conclave was launched in 2012, where it embarked on a new course of integrative approach,” says D. Deb, an independent packaging consultant and coordinator of the conference.
The conclave will focus on maintaining design innovation, brand values and consumer convenience through the process to ensure that the consumer gets what designer and brand owner conceived. This approach themed in at the conclave will enable participants to reorient and strategize their packaging design effort for world class outcome. Sustainability and innovation can be more solidly built in as all players develop a common vision. The brand wins, the converter wins, the packaging machinery supplier wins, the consumer wins and the economy grows.
The event, structured around three panel discussions with professionals from leading companies participating, will span the full bandwidth of technology, process and design.
The keynote presentation will be made by the highly acclaimed strategist and designer, Shombit Sengupta. While Nick Talbot, Global Design Head of Tata Elxsi, whose expertise covers advanced graphic and structural design, will summarise the takeaways from the conclave.
The leading companies that will contribute to the deliberations include Mondelez International, HP India Sales (P) Ltd., Tata Elxsi Ltd., Esko Graphics India (P) Ltd.,
Trigon Digital Solutions, Emami Ltd., The Black Sheep, Ecobliss India (P) Ltd., ITC Ltd., Bobst India (P) Ltd., Windmoeller & Hoelscher, Infor India (P) Ltd., Uflex Ltd., Nordson India (P) Ltd., Firstouch Solutions (P) Ltd., Signode India, PPL Huhtamaki and Indi Design (P) Ltd.
The conclave will be followed by PackPlus 2013, the four-day total packaging, processing & supply chain event, starting 6 October 2013 at India Expo Centre, Greater Noida, New Delhi (NCR).
View entire program on: www.packagingconclave.com
* Encl. Conclave logo & brochure
In Box:
First Time Ever In India- See Live Machines Synchronised Using PackML Standards
Now see the concept discussed in 2012 conclave on the exhibition floor
In the International Packaging Conclave 2012, the focus was on Packaging Line Integration. Dr. Brian Griffen of Nestle brilliantly illustrated Nestle’s problem with 5,00,000 pieces of packaging equipment in over 150 countries of the world. Every equipment has a different controller, sourced from among myriad automation vendors. A variety of communication protocols are followed. Nestle is developing and using the PackML protocol under the aegis of OMAC to standardize and simplify line integration, make HMI more user friendly and help to increase OEE.
PackPlus 2013 exhibition will demonstrate a LIVE packaging line with three robots nicely integrated under PackML. The exercise will involve different OEMS, Packaging Machines and Robots, seamlessly integrated with a globally standardized protocol based on STATES and MODES with standardized HMI and SCADA outputs.
