PackPlus South raised its curtains today at the BIEC in Bengaluru. This is the 
first time the city is witnessing a packaging expo.
The exhibitor side of the four-day show is light, however, major manufacturers of filling machines, pouch making systems, FFS lines and corrugation have marked their presence at the show.
The key players at the show are Uflex, Hilda Automation, Godrej & Boyce, IMA-PG India, Nordson and Videojet Technologies among others.
Schneider is pushing its energy conservation solutions. This is a key area that MSME firms need to explore at the show.
Among gluing players, Nordson and Robatech are seen flaunting their expertise for packaging applications. Nordson showcased the MiniBlue II hotmelt applicators which, according to the company, are ideal for operations with close flap-compression sections or smaller flaps with shorter adhesive beads, these applicators deliver consistent, robust performance.
In corrugation segment, the multilocational Ficus Pax are boasting about their award winning packaging innovations. Other corrugation specialists at the show are Tri-Wall and Om Packaging.
Bengaluru-based Edis team with plants in Italy and Romania are creating a niche in promotional trade cards.
Prajwal Marketing’s launched paper pallets. These are designed as innovation system with flexible construction, high strength characteristics made of kraft paper with water resistance coating, which doesn’t need fumigation for export. These Pallets are lightweight than wooden pallet by 35 %.
After testing the waters in Hyderabad for several years, the organisers for the first time have chosen Bengaluru to host PackPlus South. “The reason is simple,” said Neetu Arora, director, Print-Packaging.com, the organisers of the show. “The show is focused on displaying latest trends and exploring investment opportunities in South India. Bengaluru being the fastest growing city in the region will help our exhibitors discover new business prospects in the area.”
